BGA Reballing and Robotic Hot Solder Dip Solutions



 

AS9100D and ISO9001:2015 Certified

SolderQuik® BGA Reballing Preform
Technical Specifications

 
Ball Dia. Acceptable Pitch Min.
Offset
Solder Alloy Body Size (Range)
mm in. 1.27
mm
1.00
mm
0.80
mm
0.65
mm
0.50
mm
mm Pb Free Pb mm
0.762 0.030 0.90 Sn96.5-
Ag3-
Cu0.5*
Sn63-
Pb37
3.5 by
3.5

to

85 by
85
0.635 0.025 0.90
0.610 0.024 0.80
0.559 0.022 0.80
0.508 0.020 0.75
0.457 0.018 0.75
0.381 0.015 0.65
0.330 0.013 0.65
* Our Pb Free composition is known as SAC305