FOR IMMEDIATE RELEASE
Sales and Marketing Manager
WINSLOW AUTOMATION, Inc.
CELEBRATES 20 YEARS in business
Milpitas, CA - December 9, 2006 – Winslow Automation, Inc., an
industry leader in lead finish technology equipment and consumables,
announced today that it is celebrating its 20 year anniversary. Soldering
technology equipment includes both table top and a freestanding robotic lead
tinning machine known as the FlexLine®. Winslow Automation,
Inc.’s SolderQuik® Ball Grid Array (BGA) Preform is an economical
consumable product which provides a unique BGA reballing solution that
eliminates the need for stencils, loose solder balls, and solder paste in
the reballing process. In 1998, SolderQuik® was recognized by
Surface Mount Technology magazine as a Vision Award Rework and Repair
Product of the Year.
As the need for subcontract services grew and outpaced the demand for new
equipment, Winslow Automation expanded its operations to include a service
division known as S·I·X S·I·G·M·A. Utilizing its own FlexLine®
equipment to hot solder dip millions of components annually, S·I·X S·I·G·M·A
has become and remains the premier lead finish subcontractor. As a natural
extension to its soldering technology and services, Winslow Automation
acquired Raychem Corporation's SolderQuik® Products in 1996.
Since acquiring the SolderQuik® product line, Winslow Automation
has reengineered the SolderQuik CCMD technology to accommodate column grid
array applications on full land grid array components. In 2001, S·I·X
S·I·G·M·A, was the recipient of the Advanced Packaging Award for its column
attach services technology for ruggedizing COTS components.
For additional information on our products and services, call us at (408)
262-9004 and visit our web site at